{"id":1229,"date":"2025-11-21T09:32:00","date_gmt":"2025-11-21T09:32:00","guid":{"rendered":"https:\/\/fljpcb.com\/?p=1229"},"modified":"2025-11-21T09:32:38","modified_gmt":"2025-11-21T09:32:38","slug":"pcb-base-material-fr-4","status":"publish","type":"post","link":"https:\/\/fljpcb.com\/te\/pcb-base-material-fr-4\/","title":{"rendered":"PCB Base Material FR-4"},"content":{"rendered":"<p>Take apart a phone, a laptop, or a router and you will often find rigid green boards inside. If you cut the edge, you can see what looks like \u201cstacked layers.\u201d The core base material used in most of those boards is FR-4. FR-4 is the most common PCB base material in electronics. It appears in consumer devices, industrial control equipment, home appliances, and more. Globally, FR-4 makes up over 70% of the <a href=\"https:\/\/fljpcb.com\/te\/pcb-material-selection\/\">PCB base material<\/a> market each year. This article breaks down what FR-4 really is and how to choose it.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"h-what-fr-4-means\">What FR-4 Means <\/h2>\n\n\n\n<p>First, make one thing clear: FR-4 is not the name of a single formula or product. It is a flame-retardant base material standard set by NEMA (the National Electrical Manufacturers Association) in the United States. FR-4 stands for \u201cFlame Retardant, Type 4.\u201d According to the <a href=\"https:\/\/www.nema.org\/docs\/default-source\/standards-document-library\/li1.pdf?utm_source=chatgpt.com\">NEMA LI 1-1998 standard<\/a>, any material that is a glass-fiber-reinforced epoxy resin and that passes the UL94 V-0 vertical burn test can be called FR-4.<\/p>\n\n\n\n<p>The key point in this standard is flame retardancy. \u201cFR\u201d means the sample stops burning within 10 seconds after the flame is removed and it does not produce flaming droplets that ignite the cotton placed below the sample. The \u201c4\u201d is the level number. Lower levels such as FR-1 (phenolic paper) and FR-2 (epoxy paper) have poorer flame resistance and higher moisture absorption (&gt;8%). Those now appear rarely in mainstream electronics and are mostly only found in very low-cost toys or simple boards.<\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"h-core-composition-a-composite-of-glass-cloth-and-epoxy-resin\">Core Composition \u2014 A Composite of Glass Cloth and Epoxy Resin<\/h2>\n\n\n\n<p>At its core, FR-4 is a composite material. It is made mainly of two parts, similar to \u201crebar plus concrete\u201d in a building. The materials are pressed and cured under heat and pressure. Typical processing conditions are 170\u2013190\u00b0C and 20\u201330 kg\/cm\u00b2 pressure, with cure times usually from 60 to 90 minutes.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"h-glass-fiber-cloth-the-reinforcement\"> Glass Fiber Cloth (the Reinforcement)<\/h3>\n\n\n\n<p>The glass cloth acts as the structural frame. It makes up about 55%\u201365% of the base material by weight. The common type is E-glass (electrical glass). Typical E-glass contains 54%\u201356% silicon dioxide (SiO\u2082) and alkali metal oxides below 0.8%. E-glass gives good mechanical strength and dimensional stability.<\/p>\n\n\n\n<p>High-end FR-4 may use S-glass (high strength glass). S-glass offers roughly 30% higher tensile strength than E-glass, but it raises cost by over 50%.<\/p>\n\n\n\n<p>Weaving density of the cloth is described as warp \u00d7 weft. For example:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>7628 cloth: warp 46 threads\/inch, weft 38 threads\/inch \u2014 commonly used as multilayer core material.<\/li>\n\n\n\n<li>2116 cloth: warp 76\/inch, weft 68\/inch \u2014 used for thinner base laminates.<\/li>\n<\/ul>\n\n\n\n<p>This composite structure allows FR-4 to withstand drilling at speeds above 10,000 rpm in PCB production. Minimum drilled hole diameter can reach 0.1 mm.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"h-epoxy-resin-the-matrix-and-binder\">Epoxy Resin (the Matrix and Binder)<\/h3>\n\n\n\n<p>Epoxy resin is the binder and matrix. It accounts for about 35%\u201345% of the base material by weight. The resin molecules generally contain two epoxy groups. When cured with amine-based hardeners, they form a three-dimensional network. Typical cure shrinkage is only 1%\u20132%, much lower than polyester resins (5%\u20138%).<\/p>\n\n\n\n<p>Electronic-grade epoxies are often bisphenol A type. They have high volume resistivity (\u226510\u00b9\u2074 \u03a9\u00b7cm), which provides strong electrical insulation between circuits on the board and helps prevent leakage and short circuits. Epoxy also resists acids, bases, and many organic solvents. After 1,000 hours in 85\u00b0C\/85% RH aging, the insulation resistance usually remains at least 70% of its initial value.<\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"h-key-properties-balanced-performance-and-cost-parameter-table\">Key Properties \u2014 Balanced Performance and Cost (Parameter Table)<\/h2>\n\n\n\n<p>FR-4 is a general-purpose choice because it balances many properties well. Below is a typical parameter table comparing ordinary FR-4, high-Tg FR-4, and halogen-free FR-4. Test standards listed are the common industry references.<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Property<\/th><th>Ordinary FR-4 (E-glass)<\/th><th>High-Tg FR-4 (E-glass)<\/th><th>Halogen-Free FR-4 (E-glass)<\/th><th>Test Standard<\/th><\/tr><\/thead><tbody><tr><td>Dielectric constant (\u03b5r) @ 1 GHz<\/td><td>4.5 \u00b1 0.2<\/td><td>4.4 \u00b1 0.2<\/td><td>4.6 \u00b1 0.2<\/td><td>IPC-TM-650 2.5.5.5<\/td><\/tr><tr><td>Dissipation factor (tan \u03b4) @ 1 GHz<\/td><td>0.02 \u00b1 0.003<\/td><td>0.018 \u00b1 0.002<\/td><td>0.022 \u00b1 0.003<\/td><td>IPC-TM-650 2.5.5.5<\/td><\/tr><tr><td>Glass transition temperature (Tg)<\/td><td>130\u2013150 \u00b0C<\/td><td>170\u2013200 \u00b0C<\/td><td>140\u2013160 \u00b0C<\/td><td>IPC-TM-650 2.4.25<\/td><\/tr><tr><td>Continuous use temperature<\/td><td>\u2264 105 \u00b0C<\/td><td>\u2264 125 \u00b0C<\/td><td>\u2264 110 \u00b0C<\/td><td>IEC 60216-1<\/td><\/tr><tr><td>Thermal decomposition (Td)<\/td><td>\u2265 340 \u00b0C<\/td><td>\u2265 360 \u00b0C<\/td><td>\u2265 350 \u00b0C<\/td><td>IPC-TM-650 2.4.31<\/td><\/tr><tr><td>Flexural strength (room temp)<\/td><td>\u2265 150 MPa (longitudinal)<\/td><td>\u2265 160 MPa (longitudinal)<\/td><td>\u2265 145 MPa (longitudinal)<\/td><td>IPC-TM-650 2.4.4<\/td><\/tr><tr><td>Tensile strength<\/td><td>\u2265 200 MPa<\/td><td>\u2265 220 MPa<\/td><td>\u2265 190 MPa<\/td><td>IPC-TM-650 2.4.1<\/td><\/tr><tr><td>Flame retardant rating<\/td><td>UL94 V-0<\/td><td>UL94 V-0<\/td><td>UL94 V-0<\/td><td>UL94<\/td><\/tr><tr><td>Moisture absorption (24 h \/ 23 \u00b0C)<\/td><td>\u2264 0.15%<\/td><td>\u2264 0.12%<\/td><td>\u2264 0.18%<\/td><td>IPC-TM-650 2.6.2<\/td><\/tr><tr><td>Volume resistivity<\/td><td>\u2265 10\u00b9\u2074 \u03a9\u00b7cm<\/td><td>\u2265 10\u00b9\u2075 \u03a9\u00b7cm<\/td><td>\u2265 10\u00b9\u2074 \u03a9\u00b7cm<\/td><td>IPC-TM-650 2.5.17<\/td><\/tr><tr><td>Price (CNY \/ m\u00b2)<\/td><td>80\u2013120<\/td><td>150\u2013200<\/td><td>180\u2013240<\/td><td>Market data<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>From the table, high-Tg FR-4 offers better thermal resistance and lower dielectric loss. Halogen-free FR-4 is better for environmental compliance, but has somewhat higher cost. These parameters affect PCB manufacturing and reliability. For example, only high-Tg FR-4 with Tg \u2265 170 \u00b0C can reliably pass lead-free soldering profiles with peak temperatures around 260 \u00b0C.<\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"h-common-types-grouped-by-performance-and-appearance\">Common Types \u2014 Grouped by Performance and Appearance<\/h2>\n\n\n\n<p>FR-4 is classified in many ways. The common classifications discussed in electronics forums include:<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"h-by-performance\"> By Performance<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Ordinary FR-4<\/strong>: Tg 130\u2013150 \u00b0C, medium dielectric loss. Used in normal temperature (0\u201360 \u00b0C), low-frequency (\u22645 GHz) scenarios such as set-top box or router signal layers.<\/li>\n\n\n\n<li><strong>High-Tg FR-4<\/strong>: Tg 170\u2013200 \u00b0C, about 30% better thermal stability. Used in high-temperature environments such as near engines or heavy industrial zones. Common choice for automotive ECU boards.<\/li>\n\n\n\n<li><strong>High-speed FR-4<\/strong>: Modified epoxy formulas that bring tan \u03b4 at 1 GHz below 0.015. Suitable for 1\u201310 GHz mid-to-high frequency boards, such as mid-band boards in cellular base stations. Cost is typically 20%\u201330% higher than ordinary FR-4.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"h-by-environmental-standard\">By Environmental Standard<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Halogen-containing FR-4<\/strong>: Uses brominated epoxy for flame retardancy. Good flame performance, but burning releases HBr and other toxic gases. Not compliant with many modern environmental rules and is being phased out.<\/li>\n\n\n\n<li><strong>Halogen-free FR-4<\/strong>: Uses phosphorus-based flame retardants. Chlorine and bromine content each \u2264 900 ppm, total halogens \u2264 1500 ppm. Burning produces far less toxic gas. This type is mainstream for consumer electronics.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"h-by-appearance\">By Appearance<\/h3>\n\n\n\n<p>Solder mask color determines the visible board color. The resin itself is usually light yellow. Common solder mask colors:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Green (over 80% of boards)<\/li>\n\n\n\n<li>Blue (common in medical devices)<\/li>\n\n\n\n<li>Black (military or anti-glare applications)<\/li>\n\n\n\n<li>White (LED boards to improve reflectivity)<\/li>\n<\/ul>\n\n\n\n<p>Color does not change core material properties.<\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"h-main-applications-fr-4-as-the-electronics-foundation\">Main Applications \u2014 FR-4 as the Electronics Foundation<\/h2>\n\n\n\n<p>FR-4\u2019s balance of performance and cost makes it widely used across many fields:<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"h-consumer-electronics\">Consumer Electronics<\/h3>\n\n\n\n<p>Ordinary FR-4 is used for low-frequency signal layers (for example, circuits around baseband chips, I2C lines with frequencies \u2264100 MHz) and power management PCBs in laptops. In practice, many small power boards use ordinary FR-4 without issues. For example, some power boards in entry-level phones run at 40\u201350 \u00b0C during normal use with stable performance.<\/p>\n\n\n\n\n\n<h3 class=\"wp-block-heading\" id=\"h-industrial-control\">Industrial Control<\/h3>\n\n\n\n<p>Devices like variable frequency drives and PLCs use FR-4. For higher temperature or harsher environments, high-Tg FR-4 is preferred. Siemens S7-200 PLC I\/O boards, for instance, often use Tg 170 \u00b0C material to keep stable across \u221220 to 70 \u00b0C.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"h-home-appliances\">Home Appliances<\/h3>\n\n\n\n<p>Control boards in refrigerators and washing machines have low signal frequencies (\u226450 MHz). Ordinary FR-4 gives the best cost-performance ratio. Large OEMs can reduce procurement costs by about 15% when using ordinary FR-4 in mass-produced boards.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img fetchpriority=\"high\" decoding=\"async\" width=\"700\" height=\"525\" src=\"https:\/\/fljpcb.com\/wp-content\/uploads\/2025\/11\/Application-of-FR4-Material-in-Air-Conditioner-Mainboards.webp\" alt=\"Application of FR4 Material in Air Conditioner Mainboards\" class=\"wp-image-1230\" srcset=\"https:\/\/fljpcb.com\/wp-content\/uploads\/2025\/11\/Application-of-FR4-Material-in-Air-Conditioner-Mainboards.webp 700w, https:\/\/fljpcb.com\/wp-content\/uploads\/2025\/11\/Application-of-FR4-Material-in-Air-Conditioner-Mainboards-300x225.webp 300w\" sizes=\"(max-width: 700px) 100vw, 700px\" \/><\/figure>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"h-insulation-components\">Insulation Components<\/h3>\n\n\n\n<p>FR-4 is used for stiffening <a href=\"https:\/\/fljpcb.com\/te\/products-services\/flexible-pcb\/\">flexible circuits<\/a> (FPC stiffeners), transformer insulation boards (with required temperature \u2265 105 \u00b0C), and motor insulation parts where volume resistivity \u2265 10\u00b9\u2074 \u03a9\u00b7cm is needed.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img decoding=\"async\" width=\"500\" height=\"500\" src=\"https:\/\/fljpcb.com\/wp-content\/uploads\/2025\/11\/FR4-as-FPC-Stiffener.webp\" alt=\"FR4 as FPC Stiffener\" class=\"wp-image-1232\" srcset=\"https:\/\/fljpcb.com\/wp-content\/uploads\/2025\/11\/FR4-as-FPC-Stiffener.webp 500w, https:\/\/fljpcb.com\/wp-content\/uploads\/2025\/11\/FR4-as-FPC-Stiffener-300x300.webp 300w, https:\/\/fljpcb.com\/wp-content\/uploads\/2025\/11\/FR4-as-FPC-Stiffener-150x150.webp 150w\" sizes=\"(max-width: 500px) 100vw, 500px\" \/><\/figure>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"h-how-fr-4-compares-to-other-common-base-materials-comparison-table\">How FR-4 Compares to Other Common Base Materials (Comparison Table)<\/h2>\n\n\n\n<p>FR-4 is very versatile, but special cases require other materials. Below is a comparison often used in engineering selection.<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Base material<\/th><th>\u03b5r @ 1 GHz<\/th><th>tan \u03b4 @ 1 GHz<\/th><th>Tg (\u00b0C)<\/th><th>Cost (relative to FR-4)<\/th><th>Core advantage<\/th><th>Typical use<\/th><\/tr><\/thead><tbody><tr><td>Ordinary FR-4<\/td><td>4.5 \u00b1 0.2<\/td><td>0.02 \u00b1 0.003<\/td><td>130\u2013150<\/td><td>1\u00d7<\/td><td>Cost-effective, mature process<\/td><td>Appliance control, low-end routers<\/td><\/tr><tr><td>High-Tg FR-4<\/td><td>4.4 \u00b1 0.2<\/td><td>0.018 \u00b1 0.002<\/td><td>170\u2013200<\/td><td>1.5\u20132\u00d7<\/td><td>High thermal stability<\/td><td>Automotive ECU, industrial drives<\/td><\/tr><tr><td>Rogers 4350B<\/td><td>3.48 \u00b1 0.05<\/td><td>0.0037 \u00b1 0.0002<\/td><td>170<\/td><td>8\u201310\u00d7<\/td><td>Extremely low high-frequency loss, stable impedance<\/td><td>5G RF boards, microwave antennas<\/td><\/tr><tr><td>Nelco N4000-13<\/td><td>3.65 \u00b1 0.05<\/td><td>0.0045 \u00b1 0.0003<\/td><td>210<\/td><td>6\u20138\u00d7<\/td><td>High Tg, low loss<\/td><td>Data center 25 Gbps Ethernet boards<\/td><\/tr><tr><td>FR-5<\/td><td>4.6 \u00b1 0.2<\/td><td>0.02 \u00b1 0.003<\/td><td>170<\/td><td>1.2\u20131.5\u00d7<\/td><td>Better moisture resistance than FR-4<\/td><td>Humid environment devices<\/td><\/tr><tr><td>Polyimide (PI)<\/td><td>3.5 \u00b1 0.2<\/td><td>0.008 \u00b1 0.001<\/td><td>260<\/td><td>10\u201312\u00d7<\/td><td>Flexible, very high temp<\/td><td>Wearables, aerospace flex circuits<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>From this table:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>For very high frequencies (>10 GHz), Rogers 4350B has much lower loss. Its tan \u03b4 is about one-fifth of FR-4, reducing attenuation and maintaining impedance.<\/li>\n\n\n\n<li>For very high temperatures (>125 \u00b0C), polyimide\u2019s Tg around 260 \u00b0C is superior.<\/li>\n\n\n\n<li>For humid or wet environments, FR-5 has lower moisture absorption and may be more reliable.<\/li>\n<\/ul>\n\n\n\n<p>Test results often show that at 25 GHz, FR-4 signal loss can reach 0.8 dB\/in, while Rogers 4350B may show only 0.15 dB\/in.<\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"h-limitations-when-not-to-use-fr-4\">Limitations \u2014 When Not to Use FR-4<\/h2>\n\n\n\n<p>FR-4 is not universal. The common limitations and the scenarios that call for other materials are:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Poor performance at high frequencies<\/strong>: Above 5 GHz, tan \u03b4 tends to rise with frequency. At 5 GHz tan \u03b4 may reach ~0.025, at 10 GHz ~0.03, and at 25 GHz ~0.04. Signal attenuation becomes large. For Massive MIMO antenna boards working around 24\u201330 GHz, FR-4 can cut transmission distance by more than half, so Rogers materials are required.<\/li>\n\n\n\n<li><strong>Dielectric stability under temperature variation<\/strong>: With temperature swings between \u221240 and 85 \u00b0C, ordinary FR-4 dielectric constant can vary by about \u00b15%. That can cause impedance shifts beyond allowed tolerances for high-speed memory like DDR5 (impedance tolerance \u00b15%). Tests show FR-4 impedance drift up to 12% in extreme cold, while some high-performance materials show only 3% drift.<\/li>\n\n\n\n<li><strong>Limited moisture resistance<\/strong>: Ordinary FR-4 can lose dielectric strength after 500 hours at 85 \u00b0C \/ 85% RH, with degradation ~30%. That makes it unsuitable for long-term submerged or highly wet applications.<\/li>\n\n\n\n<li><strong>Low flexibility<\/strong>: FR-4 is rigid. It will break if bent to a radius less than about 50 mm. For flexible or foldable devices (smartwatches, foldable phones), polyimide or flexible copper-clad laminates are the right choices.<\/li>\n<\/ul>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"h-simple-decision-flow-for-selecting-pcb-base-material\">Simple Decision Flow for Selecting PCB Base Material<\/h2>\n\n\n\n<p>Follow this quick checklist:<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Is the use frequency > 5 GHz?\n<ul class=\"wp-block-list\">\n<li>Yes \u2192 consider high-speed FR-4, Nelco N4000-13, or Rogers.<\/li>\n\n\n\n<li>No \u2192 go to next question.<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>Is operating temperature > 125 \u00b0C?\n<ul class=\"wp-block-list\">\n<li>Yes \u2192 consider PI or high-Tg materials.<\/li>\n\n\n\n<li>No \u2192 next question.<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>Is flexibility needed?\n<ul class=\"wp-block-list\">\n<li>Yes \u2192 choose PI or flexible substrates.<\/li>\n\n\n\n<li>No \u2192 next question.<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>Is the environment very humid or underwater?\n<ul class=\"wp-block-list\">\n<li>Yes \u2192 consider FR-5 or specialized waterproof materials.<\/li>\n\n\n\n<li>No \u2192 next question.<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>Do you need strict environmental compliance (low halogens)?\n<ul class=\"wp-block-list\">\n<li>Yes \u2192 choose halogen-free FR-4.<\/li>\n\n\n\n<li>No \u2192 ordinary FR-4 may be fine.<\/li>\n<\/ul>\n<\/li>\n<\/ol>\n\n\n\n<p>In short: for ordinary low-frequency, normal-temperature applications choose ordinary FR-4. For higher thermal stress use high-Tg FR-4. For mid-to-high frequency boards use low-loss FR-4 or special laminates. For extreme high frequency or precision RF, use Rogers or similar.<\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"h-conclusion\">Conclusion<\/h2>\n\n\n\n<p>FR-4 became the standard base material in electronics because it balances flame retardancy, mechanical strength, electrical insulation, and low cost. It supports a wide range of devices\u2014from cheap appliance control boards to important industrial PCBs. Yet FR-4 is not the best for every case. <a href=\"https:\/\/fljpcb.com\/te\/products-services\/high-frequency-pcb\/\">High-frequency<\/a>, high-temperature, flexible, or underwater applications often need specialty materials.<\/p>\n\n\n\n<p>As engineers say: \u201cThere is no single best material. There is only the material that best matches the requirements.\u201d Match the electrical, thermal, mechanical, and cost constraints, and then pick the base material that fits. That is the right way to choose between FR-4 and the many other options available.<\/p>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>Take apart a phone, a laptop, or a router and you will often find rigid green boards inside. If you cut the edge, you can see what looks like \u201cstacked layers.\u201d The core base material used in most of those boards is FR-4. FR-4 is the most common PCB base material in electronics. It appears [&hellip;]<\/p>","protected":false},"author":1,"featured_media":1233,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[],"class_list":["post-1229","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-uncategorized"],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v26.3 (Yoast SEO v27.4) - https:\/\/yoast.com\/product\/yoast-seo-premium-wordpress\/ -->\n<title>PCB Base Material FR-4 - Philifast - Fast PCB &amp; PCBA Manufacturer<\/title>\n<meta name=\"description\" content=\"Comprehensive guide to FR-4 PCB material: composition, performance, types, and applications in electronics, industry, and consumer devices.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/fljpcb.com\/te\/pcb-base-material-fr-4\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"PCB Base Material FR-4\" \/>\n<meta property=\"og:description\" content=\"Comprehensive guide to FR-4 PCB material: composition, performance, types, and applications in electronics, industry, and consumer devices.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/fljpcb.com\/te\/pcb-base-material-fr-4\/\" \/>\n<meta property=\"og:site_name\" content=\"Philifast - Fast PCB &amp; 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