Capabilities & Technology

Item	Item Name	Process Capability
Overall ProcessCapability	Number of Layers	1-30 Layers
	High-Frequency Hybrid Press HDI	For ceramic materials and PTFE materials, only mechanical drilling for blind/buried vias, depth-controlled drilling, back drilling, etc. are applicable (laser drilling is not allowed, and direct lamination of copper foil is not allowed)
	High-Speed HDI	Manufactured according to conventional HDI processes
	Laser Stages	1-5 Stages (Review required for ≥6 stages)
	Board Thickness Range	0.1-5.0mm (Review required for thickness ＜0.2mm or ＞6.5mm)
	Minimum Finished Size	Single board: 5*5mm (Review required for ＜3mm)
	Maximum Finished Size	2-20 Layers: 21*33inch; Note: Review required if the short side of the board exceeds 21inch.
	Maximum Finished Copper Thickness	Outer layer: 8OZ (Review required for ＞8OZ); Inner layer: 6OZ (Review required for ＞6OZ)
	Minimum Finished Copper Thickness	1/2oz
	Interlayer Alignment Accuracy	≤3mil
	Through-Hole Filling Range	Board thickness ≤0.6mm, Hole diameter ≤0.2mm
	Resin Plugging Board Thickness Range	0.254-6.0mm; Review required for resin plugging of PTFE boards
	Board Thickness Tolerance	Board thickness ≤1.0mm: ±0.1mm
	Board Thickness Tolerance	Board thickness ＞1.0mm: ±10%
	Impedance Tolerance	±5Ω (＜50Ω), ±10% (≥50Ω); ±8% (≥50Ω, Review required)
	Warpage	Conventional: 0.75%, Limit: 0.5% (Review required), Maximum: 2.0%
	Lamination Times	Maximum 5 laminations for the same core board (Review required for ＞3 laminations)
MaterialTypes	Standard Tg FR4	Shengyi S1141, Kingboard KB6160A, Guoji GF212
	Medium Tg FR4	Shengyi S1150G (Medium Tg board), Kingboard KB6165F, Kingboard KB6165G (Halogen-Free)
	High Tg FR4	Shengyi S1600 (Halogen-Free), Kingboard KB6167G (Halogen-Free), Kingboard KB6167F
	Aluminum Substrate	Guoji GL12, Boyu Series 3, 1-8 Layers Hybrid Press FR-4
	Material Types for HDI Boards	LDPP (IT-180A 1037 and 1086), Conventional 106 and 1080
	High CTI	Shengyi S1600
	High Tg FR4	Isola: FR408, FR408HR, IS410, FR406, GETEK, PCL-370HR; Lenton: IT-180A,
		IT-150DA; Nelco: N4000-13, N4000-13EP, N4000-13SI, N4000-13EP
		SI; Panasonic: R-5775K (Megtron6), R-5725 (Megtron4); Kingboard: KB6167F;
		Taiguang: EM-827; Hongren: GA-170; Nanya: NP-180; Taiyao: TU-752, TU-662;
		Hitachi: MCL-BE-67G (H), MCL-E-679 (W), MCL-E-679F (J); Tenghui: VT-47;
	Ceramic Powder Filled High-Frequency Materials	Rogers: Rogers4350, Rogers4003; Arlon: 25FR, 25N;
	PTFE High-Frequency Materials	Rogers Series, Taconic Series, Arlon Series, Nelco Series, TP Series
	PTFE Prepreg	Taconic: TP Series, TPN Series, HT1.5 (1.5mil), Fastrise Series
	Hybrid Material Lamination	Rogers, Taconic, Arlon, Nelco with FR-4
MetalSubstrate	Number of Layers	Aluminum substrate, Copper substrate: 1-8 Layers; Cold plate, Sintered plate, Metal-embedded plate: 2-24 Layers; Ceramic plate: 1-2 Layers;
	Finished Size (Aluminum Substrate, Copper Substrate, Cold Plate, Sintered Plate, Metal-Embedded Plate)	MAX: 610610mm, MIN: 55mm
	Maximum Production Size (Ceramic Plate)	100*100mm
	Finished Board Thickness	0.5-5.0mm
	Copper Thickness	0.5-10 OZ
	Metal Base Thickness	0.5-4.5mm
	Metal Base Material	AL: 1100/1050/2124/5052/6061; Copper: Pure Copper, Pure Iron
	Minimum Finished Hole Diameter and Tolerance	NPTH: 0.5±0.05mm; PTH (Aluminum substrate, Copper substrate): 0.3±0.1mm; PTH (Cold plate, Sintered plate, Metal-embedded plate): 0.2±0.10mm;
	Profile Machining Accuracy	±0.2mm
	PCB Partial Surface Treatment Processes	Lead-containing/Lead-free Hot Air Solder Leveling (HASL); OSP; Electroless Nickel (Palladium) Gold (EN(Au)G); Electroplated (Nickel) Soft/Hard Gold; Electroplated Tin; Nickel-Free Electroplated Soft/Hard Gold; Thick Gold Fabrication
	Metal Surface Treatment	Copper: Nickel-Gold Plating; Aluminum: Anodizing, Hard Anodizing, Chemical Passivation; Mechanical Treatment: Dry Sandblasting, Brushing
	Metal Base Materials	Quanbao Aluminum Substrate (T-110, T-111); Tenghui Aluminum Substrate (VT-4A1, VT-4A2, VT-4A3); Laird Aluminum Substrate (1KA04, 1KA06); Bergquist Metal Substrate (MP06503, HT04503); TACONIC Metal Substrate (TLY-5, TLY-5F);
	Thermal Conductive Adhesive Thickness (Dielectric Layer)	75-150um
	Embedded Copper Block Size	33mm—7080mm
	Embedded Copper Block Flatness (Height Difference Accuracy)	±40um
	Distance from Embedded Copper Block to Hole Wall	≥12mil
	Thermal Conductivity	0.3-3W/m.k (Aluminum substrate, Copper substrate, Cold plate); 8.33W/m.k (Sintered plate); 0.35-30W/m.k (Metal-embedded plate); 24-180W/m.k (Ceramic plate);
Product Type	Rigid Board	Backplane, HDI, Multilayer Blind/Buried Via Board, Thick Copper Board, Power Supply Thick Copper Board, Semiconductor Test Board
Lamination Method	Multi-Lamination Blind/Buried Via Board	Maximum 3 laminations on the same side
Lamination Method	HDI Board Type	1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3 (n: buried via ≤0.3mm); Laser blind vias can be electroplated and filled
Partial Hybrid Lamination	Minimum Distance from Mechanical Drilling to Conductor in Partial Hybrid Lamination Area	≤10 Layers: 14mil; 12 Layers: 15mil; ＞12 Layers: 18mil
Partial Hybrid Lamination	Minimum Distance from Partial Hybrid Lamination Junction to Drilling	≤12 Layers: 12mil; ＞12 Layers: 15mil
Surface Treatment	Lead-Free	Electroplated Copper-Nickel-Gold, Immersion Gold, Hard Gold Plating (With/Without Nickel), Gold Finger Plating, Lead-Free HASL, OSP, Electroless Nickel Palladium Gold (ENPG), Soft Gold Plating (With/Without Nickel), Immersion Silver, Immersion Tin, ENIG+OSP, ENIG+G/F, Full-Board Gold Plating+G/F, Immersion Silver+G/F, Immersion Tin+G/F
	Lead-Containing	Lead-Containing HASL
	Aspect Ratio	10:1 (Lead-Containing/Lead-Free HASL, Electroless Nickel-Immersion Gold (ENIG), Immersion Silver, Immersion Tin, ENPG); 8:1 (OSP)
	Maximum Machining Size	Immersion Gold: 520800mm; Vertical Immersion Tin: 500600mm; Horizontal Immersion Tin: Single side ＜500mm; Horizontal Immersion Silver: Single side ＜500mm; Lead-Containing/Lead-Free HASL: 520650mm; OSP: Single side ＜500mm; Electroplated Hard Gold: 450500mm; Single side shall not exceed 520mm
	Minimum Machining Size	Immersion Tin: 6080mm; Immersion Silver: 6080mm; Lead-Containing/Lead-Free HASL: 150230mm; OSP: 6080mm; Sizes smaller than the above shall undergo surface treatment with large boards
	Machining Board Thickness	Immersion Gold: 0.2-7.0mm; Immersion Tin: 0.3-7.0mm (Vertical Immersion Tin Line), 0.3-3.0mm (Horizontal Line); Immersion Silver: 0.3-3.0mm; Lead-Containing/Lead-Free HASL: 0.6-3.5mm; Review required for HASL boards with thickness ＜0.4mm; OSP: 0.3-3.0mm; Electroplated Hard Gold: 0.3-5.0mm (Board Aspect Ratio 10:1)
	Minimum IC Pitch or Minimum PAD-to-Line Distance for Immersion Gold Boards	3mil
	Maximum Gold Finger Height	1.5inch
	Minimum Pitch Between Gold Fingers	6mil
	Minimum Segmentation Pitch for Segmented Gold Fingers	7.5mil
Poraus	Maximum Board Thickness for 0.1/0.15/0.2mm Mechanical Drilling	0.8mm/1.5mm/2.5mm
	Minimum Laser Drilling Hole Diameter	0.1mm
	Maximum Laser Drilling Hole Diameter	0.15mm
	Mechanical Hole Diameter (Finished Product)	0.10-6.2mm (Corresponding drill bit: 0.15-6.3mm)
		Minimum finished hole diameter for PTFE material (including hybrid lamination) boards: 0.25mm (Corresponding drill bit: 0.35mm)
		Mechanical blind/buried via diameter ≤0.3mm (Corresponding drill bit: 0.4mm)
		Drilling diameter for solder mask plugging of via-in-pad ≤0.45mm (Corresponding drill bit: 0.55mm)
		Minimum linked hole diameter: 0.35mm (Corresponding drill bit: 0.45mm)
		Minimum diameter of metalized half-hole: 0.30mm (Corresponding drill bit: 0.4mm)
	Maximum Aspect Ratio of Through-Holes	20:1 (Excluding drill diameter ≤0.2mm; Review required for ＞12:1)
	Maximum Depth-to-Diameter Ratio of Laser Drilling	1:01
	Maximum Depth-to-Diameter Ratio of Mechanical Depth-Controlled Drilling for Blind Vias	1.3:1 (Hole diameter ≤0.20mm), 1.15:1 (Hole diameter ≥0.25mm)
	Minimum Depth of Mechanical Depth-Controlled Drilling (Back Drilling)	0.2mm
	Minimum Distance from Mechanical Drilling to Conductor (Non-Blind/Buried Via Boards and 1st-Stage Laser Blind Vias)	5.5mil (≤8 Layers); 6.5mil (10-14 Layers); 7mil (＞14 Layers)
	Minimum Distance from Mechanical Drilling to Conductor (Mechanical Blind/Buried Via Boards and 2nd-Stage Laser Blind/Buried Vias)	7mil (1st Lamination); 8mil (2nd Lamination); 9mil (3rd Lamination)
	Minimum Distance from Laser Drilling to Conductor (Laser Blind/Buried Vias)	7mil (1+N+1); 8mil (1+1+N+1+1 or 2+N+2)
	Minimum Distance from Laser Drilling to Conductor (1st, 2nd-Stage HDI Boards)	5mil
	Minimum Distance Between Hole Walls of Different Networks (After Compensation)	10mil
	Minimum Distance Between Hole Walls of the Same Network (After Compensation)	6mil (Through-holes; Laser blind vias); 10mil (Mechanical blind/buried vias)
	Minimum Distance Between Non-Metal Hole Walls (After Compensation)	8mil
	Hole Position Tolerance (Compared with CAD Data)	±2mil
	Minimum Hole Diameter Tolerance of NPTH Holes	±2mil
	Hole Diameter Accuracy of Solderless Component Holes	±2mil
	Tapered Hole Depth Tolerance	±0.15mm
	Tapered Hole Orifice Diameter Tolerance	±0.15mm
Pad(Ring)	Minimum Size of Inner/Outer Layer Pads for Laser Holes	10mil (4mil laser hole), 11mil (5mil laser hole)
	Minimum Size of Inner/Outer Layer Pads for Mechanical Through-Holes	16mil (8mil hole diameter)
	Minimum BGA Pad Diameter	10mil for lead-containing HASL process, 12mil for lead-free HASL process, 7mil for other processes
	BGA Pad Tolerance	+/-1.2mil (Pad ＜12mil); +/-10% (Pad ≥12mil)
Line Width/Spacing	Minimum Line Width Corresponding to Copper Thickness	1/2OZ: 3/3mil
		1OZ: 3/4mil
		2OZ: 5/5mil
		3OZ: 7/7mil
		4OZ: 12/12mil
		5OZ: 16/16mil
		6OZ: 20/20mil
		7OZ: 24/24mil
		8OZ: 28/28mil
		9OZ: 30/30mil
		10OZ: 32/30mil
	Line Width Tolerance	≤10mil: +/-1.0mil
	Line Width Tolerance	＞10mil: +/-1.5mil
Solder Mask&Legends	Maximum Drilling Diameter for Solder Mask Plugging (Solder Mask on Both Sides)	0.5mm
	Solder Mask Ink Color	Green, Yellow, Black, Blue, Red, White, Purple, Matte Green, Matte Black, High Refractive White Ink
	Legend Ink Color	White, Yellow, Black
	Maximum Diameter for Blue Tape Aluminum Sheet Plugging	5mm
	Drilling Diameter Range for Resin Plugging	0.1-1.0mm
	Maximum Aspect Ratio for Resin Plugging	12:01
	Minimum Solder Mask Bridge Width	4mil for green ink, 6mil for other colors; Special requirements required for solder mask bridge control
	Minimum Legend Line Width	3mil width, 24mil height for white legends; 5mil width, 32mil height for black legends
	Minimum Spacing for Hollowed-Out Legends	8mil width, 40mil height for hollowed-out parts
	Hollowed-Out Legends on Solder Mask Layer	8mil width, 40mil height for hollowed-out parts
Profile	Distance from V-CUT Center Line (Without Copper Exposure) to Pattern	H≤1.0mm: 0.3mm (V-CUT angle 20°), 0.33mm (30°), 0.37mm (45°);
		1.0＜H≤1.6mm: 0.36mm (20°), 0.4mm (30°), 0.5mm (45°);
		1.6＜H≤2.4mm: 0.42mm (20°), 0.51mm (30°), 0.64mm (45°);
		2.4＜H≤3.2mm: 0.47mm (20°), 0.59mm (30°), 0.77mm (45°);
	V-CUT Symmetry Tolerance	±4mil
	Maximum Number of V-CUT Lines	100 Lines
	V-CUT Angle Tolerance	±5 Degrees
	V-CUT Angle Specifications	20°, 30°, 45°
	Gold Finger Chamfer Angle	20°, 30°, 45°
	Gold Finger Chamfer Angle Tolerance	±5 Degrees
	Minimum Distance for Undamaged TAB Beside Gold Fingers	6mm
	Minimum Distance Between Gold Finger Side and Profile Edge Line	8mil
	Depth Accuracy of Depth-Controlled Milled Slots (Edges) (NPTH)	±0.10mm
	Profile Dimension Accuracy (Edge-to-Edge)	±8mil
	Minimum Tolerance of Milled Slots (PTH)	±0.15mm in both slot width and slot length directions
	Minimum Tolerance of Milled Slots (NPTH)	±0.10mm in both slot width and slot length directions
	Minimum Tolerance of Drilled Slots (PTH)	±0.075mm in slot width direction; Slot length/slot width ＜2: +/-0.1mm in slot length direction; Slot length/slot width ≥2: +/-0.075mm in slot length direction
	Minimum Tolerance of Drilled Slots (NPTH)	±0.05mm in slot width direction; Slot length/slot width ＜2: +/-0.075mm in slot length direction; Slot length/slot width ≥2: +/-0.05mm in slot length direction

Item	Unit	Ceramic PCB Process Capabilities
Minimum Hole Diameter	mm	0.05
Hole Taper Tolerance	%	±30
Drilling Position Accuracy	mm	0.025
Slot Tolerance: Length ≥ 2×Width	mm	Length: ±0.05; Width: ±0.025
Slot Tolerance: Length < 2×Width	mm	Length: ±0.025; Width: ±0.010
Trace Alignment Accuracy	mm	±0.025; Interlayer Alignment: 0.025
Minimum Line Width/Spacing	mm	0.075/0.040
Overall Line Width Compensation (DPC Process)	mm	0.02 (No copper thickness restriction, DPC process only)
Negative Film Direct Etching Process	mm	10Z copper thickness: 0.025 line width compensation; 20Z copper thickness: 0.05 line width compensation; 30Z copper thickness: 0.075 line width compensation; 80Z copper thickness: 0.15 line width compensation
Surface Copper Thickness	um	18, 35, 70, 140, 300, 400
Hole Aspect Ratio	/	8:1
Etch Factor	/	＞4
Metal Dam	um	50 – 800
Ink Thickness (Per customer’s requirement if specified)	um	Trace Surface: ≥10; Trace Corner: ≥8
Weir Ink Thickness	um	80 – 120
Solder Mask Alignment Tolerance	mm	±0.075
Minimum Single-Side Width of Solder Mask Covering Trace	mm	10Z surface copper: 0.075; 20Z surface copper: 0.10; 30Z surface copper: 0.15; 40Z surface copper: 0.175
Minimum Opening of Solder Mask Film Character (Minimum Line Width)	mm	0.15
Minimum Character Line Width	mm	≥0.12
Character Alignment Tolerance	mm	±0.15
Minimum Character Height	mm	≥0.75
Minimum Character Spacing	mm	≥0.10
Immersion Gold	um	Gold Thickness: 0.025 – 0.10; Nickel Thickness: 2 – 8
Immersion Silver	um	Silver Thickness: 0.2 – 0.5
Immersion Tin	um	Tin Thickness: 0.2 – 1 (Hot Air Solder Leveling is not applicable for ceramic boards)
OSP (Oxidation Resistance)	/	OSP Film Thickness: 2 – 5 u”
Electroless Nickel Palladium Gold (ENEPIG)	um	Gold Thickness: 0.025 – 0.050; Palladium Thickness: 0.025 – 0.075; Nickel Thickness: 2 – 8
Minimum Distance from Cutting Line to Trace	mm	0.2
Alignment of Upper & Lower Cutting Lines (Controlled for Double-Sided Scribed Boards)	mm	±0.025
Residual Thickness Control Accuracy	mm	±0.075; Scribing Depth for Panelized Boards: 1/2 of total board thickness; Scribing Depth for Peripheral Depaneling Lines: 2/3 of total board thickness
Offset Accuracy Tolerance	mm	±0.025
Laser Cutting Line Width	mm	0.1
Laser Profile Tolerance	mm	±0.10
LTCC Process Sintered Silver Paste – Thickness	um	10 – 20
LTCC Process Sintered Silver Paste – Line Width	mm	＞0.1
LTCC Process Sintered Silver Paste – Line Spacing	mm	＞0.15
Material	–	Alumina	Alumina	Aluminum Nitride
Purity	%	96	99.60	/
Appearance	/	White	White	Cyan
Density	g/cm³	3.72	3.85	3.3
Average Particle Size	um	3 – 4	＜1.5	＜1
Thermal Conductivity	w/m·k	22.3	29.5	170
Coefficient of Thermal Expansion (CTE)	x10⁻⁶/℃ (RT~800℃)	8	8.2	4.4
Dielectric Breakdown Strength	v/m	14×10⁶	18×10⁶	14×10⁶
Resistivity	/	＞10¹⁴	＞10¹⁴	＞10¹⁴
Dielectric Constant	(1MHz)	9.5	9.8	9
Dielectric Loss Tangent	(1MHz, x10⁻⁴)	3	2	4
Flexural Strength	Mpa	350	500	300
Dimension	mm	114×114/120×120/127×127/130×140/140×190	–	–
Thickness	mm	0.2/0.25/0.3/0.38/0.5/0.635/0.8/1.0/1.2/1.5	–	–
Warpage	%	≤0.3	≤0.3	≤0.3

Item	Unit	Aluminum PCB Manufacturing Capability
Base Material Brand	/	Guoji GL11 / Guangzhou Aluminum / Ventec / Isola / Rogers
Solder Mask Ink	/	Libang Series
Finished Copper Thickness	μm	18 / 25 / 35 / 70 (0.5oz / 0.75oz / 1oz / 2oz)
Board Thickness Range	mm	0.2 – 5.0
Thickness Tolerance (t ≥ 1.0mm)	%	±10
Thickness Tolerance (t < 1.0mm)	mm	±0.1
Thermal Conductivity	W/m·K	1 – 12
Minimum Line Width	%	±10
Minimum Spacing	mil	8 (0.2mm)
Drill Hole Diameter	mm	≥ board thickness & ≥ 1.0
Hole Tolerance	mm	±0.1
Solder Mask Type	/	Photoimageable Ink
Solder Mask Bridge	mm	0.15
Min. Character Width	mm	≥0.15
Min. Character Height	mm	≥1.0
Maximum Board Size	mm	Standard: 480 × 580 / Large: 580 × 1180 (Custom available)
Outline Accuracy	mm	±0.15
Trace to Board Edge Clearance	mm	≥0.3 (12mil)
Panelization (Zero-gap)	/	Zero-gap panelization (no spacing between boards in panel shipment)
Panelization (With Gap)	mm	2.0 (Panel gap should not be less than 2.0mm, otherwise routing is difficult)
Surface Finish	/	ENIG, Immersion Silver, Immersion Tin, OSP

Item	Unit	Copper-based PCB Manufacturing Capability
Number of Layers	L	1 – 8
Product Types	/	Single-sided, Double-sided with core, Single-sided 2-layer, Single-sided 4-layer, Thermal separation (Pedestal board)
PCB Quality Standard	/	IPC-A-600/610 Class 3/2
Thermal Conductivity	W/m·K	1 – 12 (Thermal separation: 398W for pedestal board)
Max. PCB Size	mm	1200 × 480
Min. PCB Size	mm	5 × 5
PCB Thickness	mm	0.5 – 5.0
Finished Copper Thickness	oz	1 – 3
Plated Through Hole Copper Thickness	μm	20 – 35
Line Width / Spacing	mil	1oz: 4/5, 2oz: 6/8, 3oz: 10/11
PCB Warpage	%	≤ 0.5
Min. Punching Hole Diameter	mm	1.0
Min. Drilling Hole Diameter	mm	0.6
Min. Solder Mask Clearance	mm	0.35
Outline Tolerance	mm	CNC: ±0.15 / Punching: ±0.1
Copper Thickness of Circuit Layer	μm	35, 70, 105, 140, 175, 210, 245, 280, 315, 350
Routing Tolerance	mm	CNC: ±0.1 / Punching: ±0.1
Surface Finish & Thickness	/	ENIG: Au 0.0254–0.127 μm, Ni 5–6 μm OSP / HASL (Lead-free): 40–100 μm Immersion Silver: Ag 3–8 μm Hard Gold Plating: Au 0.1–0.5 μm, Ni 4–6 μm

Item	Unit	HDI PCB Manufacturing Capability
Product Type	/	HDI ELIC (5+2+5)
PCB Layers	L	1 – 32
Board Thickness	mm	Core thickness: 0.05 – 1.5 Finished thickness: 0.3 – 3.5
Minimum Hole Diameter	mm / mil	Laser drill: 0.075mm / 3mil Mechanical drill: 0.15mm / 6mil
Minimum Line Width / Spacing	mm	0.030 / 0.030 (1.2mil / 1.2mil)
Copper Foil Thickness	oz	0.5 – 5
Max. Processing Size	mm	700 × 610
Layer-to-Layer Registration	mm	±0.05 (2mil)
Outline Tolerance	mm	±0.075 (3mil)
Min. BGA Pad	mm	0.15 (8mil)
Aspect Ratio	/	10:1
Board Warpage	%	≤ 0.5
Impedance Tolerance	%	±8
Daily Production Capacity	m²	3000
Common Materials	/	FR4 / Normal Tg / High Tg / Low Dk / HF FR4 / PTFE / PI
Surface Finish	/	Electroplated Ni/Au, OSP, HASL, Electroplated Gold, Immersion Tin

Item	Unit	FPC Manufacturing Capability
Max. Layers	L	16
Min. Finished Board Thickness	mm	0.04
Max. Size	mm	500 × 2200
Min. Laser Drill Hole	mm	0.025
Min. Mechanical Drill Hole	mm	0.1
Min. Line Width / Spacing	mm	0.035 / 0.035
Min. Annular Ring (Single / Double Side)	mm	0.075
Min. Annular Ring (Multilayer Inner Layer)	mm	0.1
Min. Annular Ring (Multilayer Outer Layer)	mm	0.1
Min. Coverlay Bridge	mm	0.1
Min. Solder Mask Opening	mm	0.15
Min. Coverlay Opening	mm	0.30 × 0.30
Min. BGA Pitch	mm	0.45
Single-ended Impedance Tolerance	%	±7
Base Material Type	/	Polyimide, LCP, PET
Base Material Brands	/	Shengyi, ITEQ, Taiflex, Newflex, Nikko, Panasonic, DuPont, Jiujiang
Stiffener Types	/	FR4, PI, PET, Steel, Aluminum, PSA, Nylon
Surface Finish	/	ENIG, ENEPIG, OSP, Electroplated Gold, Electroplated Gold + ENIG, Electroplated Gold + OSP, Immersion Silver, Immersion Tin, Electroplated Tin
Flex + HDI	/	2+N+2 (Mass production)

Item	Unit	Rigid-Flex PCB Manufacturing Capability
Max. Layers	L	30
Max. Finished Board Thickness	mm	4.0
Max. Production Size	mm	500 × 1000
Min. Laser Drill Hole	mm	0.075
Max. Aspect Ratio	/	13:1
Min. Inner Layer Line Width / Spacing	mm	0.04 / 0.04
Min. Outer Layer Line Width / Spacing	mm	0.05 / 0.05
Solder Mask Registration Tolerance	mm	0.035
Min. Solder Mask Bridge	mm	0.08
Min. BGA Pitch	mm	0.08
Single-ended Impedance (Size)	mm	0.45
Single-ended Impedance Tolerance	%	±7
Base Materials	/	Mid-Tg, High-Tg, Low Dk, Low Loss FR4, High-frequency materials
Base Material Brands	/	Shengyi, TUC, ITEQ, Rogers, Panasonic, DuPont, Taiflex
Surface Finish	/	ENIG, ENEPIG, OSP, Electroplated Gold, Electroplated Gold + ENIG, Electroplated Gold + OSP, Immersion Silver, Immersion Tin, Electroplated Tin
Rigid-Flex + HDI	/	3+N+3 (Prototype)

Item	Unit	High-Frequency & High-Speed PCB Manufacturing Capability
Layers	L	2 – 30
Max. Board Thickness	mm	8.0
Finished Copper Thickness	oz	0.5 – 5
Thickness Tolerance	%	±10
Max. Finished Size	mm	570 × 670
Min. Finished Size	mm	1 × 1
Outline Accuracy	mm	±0.075
Slot Accuracy	mm	±0.075
Min. Hole-to-Copper Distance	mil	5
Min. Hole Diameter	mm	0.05
Min. BGA Pitch	mm	0.4
Min. Hole-to-Hole Wall Spacing (Different Nets)	mm	0.2
Hole Tolerance	mil	±2.0 (PTH) / ±1.0 (NPTH)
Hole Position Tolerance	mil	±2
Backdrill Stub	mil	4
Aspect Ratio	/	20:1
Line Width Accuracy	μm	±20
Board Warpage	%	≤0.75
Trace Width Control	mm	±0.02
Impedance Tolerance (≥50Ω)	%	±8
Max. Impedance Control Deviation	%	2
Plated Through Hole Copper Thickness	μm	Min ≥18, Avg ≥20
Solder Mask Thickness	μm	20 – 30
High-frequency PCB Types	/	6GHz–24GHz PCB, 70GHz PCB, Embedded Antenna PCB, Ceramic Hybrid Substrate PCB, PTFE-based High-frequency PCB
Base Copper Thickness	oz	0.5 – 1.0
Thermal Conductivity	W/m·K	0.15 – 0.95
PCB Via Types	/	Blind Via, Stacked Via, Staggered Via, Skip Via, Buried Via
Thermal Stress	/	10s at 288°C
Dielectric Constant (Dk)	/	ε2.1 – ε10.0
Punching or Routing Accuracy	mm	±0.10 – 0.13
Hole Wall Copper	μm	≥20
Solder Mask Ink	/	Taiyo PSR-4000, Tamura DSR-2200
Substrate Materials	/	Hydrocarbon Resin, PTFE Resin, HC Resin, PPO/PPE Resin
Surface Finish	/	ENIG, Immersion Silver, Electroplated Gold, Immersion Tin, Electroplated Tin
Special Surface Finish	/	Base Copper + Thick Gold, Base Copper + Palladium-Gold, Nickel Base + Hard Gold, etc.

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cookielawinfo-checkbox-necessary	11 kuukautta	Tämän evästeen asettaa GDPR Cookie Consent -lisäosa. Evästettä käytetään tallentamaan käyttäjän suostumus evästeille luokassa "Välttämätön".
cookielawinfo-checkbox-others	11 kuukautta	Tämän evästeen asettaa GDPR Cookie Consent -lisäosa. Evästettä käytetään tallentamaan käyttäjän suostumus evästeille kategoriassa "Muut".
cookielawinfo-checkbox-performance	11 kuukautta	Tämän evästeen asettaa GDPR Cookie Consent -lisäosa. Evästettä käytetään tallentamaan käyttäjän suostumus kategorian "Suorituskyky" evästeille.
viewed_cookie_policy	11 kuukautta	Evästeen asettaa GDPR Cookie Consent -lisäosa, ja sitä käytetään tallentamaan, onko käyttäjä antanut suostumuksensa evästeiden käyttöön. Se ei tallenna mitään henkilötietoja.

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